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DF005S - onsemi

Description: Surge overload rating: 50 amperes peak.; Low leakage.; Glass passivated junction.; Lead Free Compliant to EU RoHS 2002/95/EU Directives; Green Molding Compound: IEC61249; Qualified with IR Reflow and Wave Soldering; UL Certified, UL # E258596

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PCB Footprints
DF005S - onsemi PCB footprint - Other - Other - SOT508P985X260-4N
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DF005S - onsemi  - 3D model - Other - SOT508P985X260-4N
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DF005S Details

  • Manufacturer Part Number:

    DF005S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP-4 GW

  • Manufacturer Package Code:

    709AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    3.1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DF005S Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Use a heat sink, ensure good airflow, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation.
  • Yes, but be aware of the device's switching characteristics and ensure that the switching frequency is within the recommended range (typically up to 100 kHz).
  • Use ESD protection devices, such as TVS diodes, and consider adding overvoltage protection circuits to prevent damage from voltage spikes.

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DF005S Overview

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