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DF10S - onsemi

Description: Low leakage.; Glass passivated junction.; Surge overload rating: 50 amperes peak.; Lead Free compliant to EU RoHS 2002/95/EU Directives; Green Molding Compound: IEC61249; Qualified with IR Reflow and Wave Soldering; UL Certified, UL #E258596

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DF10S - onsemi PCB footprint - Other - Other - SOT508P985X260-4N
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DF10S - onsemi  - 3D model - Other - SOT508P985X260-4N
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DF10S Details

  • Manufacturer Part Number:

    DF10S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4 GW

  • Manufacturer Package Code:

    709AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    3.1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DF10S Frequently Asked Questions (FAQs)

  • A good PCB layout for the DF10S involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive nodes can help reduce EMI.
  • The inductor value depends on the input voltage, output voltage, and switching frequency. A good starting point is to use the inductor value recommended in the datasheet. You can also use online inductor selection tools or consult with an application engineer for more guidance.
  • The DF10S is rated for operation from -40°C to 150°C, but the maximum ambient temperature range depends on the specific application and cooling conditions. It's recommended to derate the device's power handling at higher temperatures to ensure reliable operation.
  • Yes, the DF10S is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is designed to withstand harsh environmental conditions. However, additional testing and validation may be required for specific applications.
  • Start by checking the input voltage, output voltage, and switching frequency. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for voltage spikes, ringing, or other anomalies. Consult the datasheet and application notes for troubleshooting guides and FAQs.

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DF10S Overview

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