Littelfuse recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane or a copper pour area.
To ensure reliability, it's essential to follow the recommended derating curves for temperature and current. Additionally, consider using a thermally conductive interface material between the device and the heat sink, and ensure good airflow around the device.
The DNA30EM2200PZ-TRL has a surge current rating of 300A for 10ms, as specified in the datasheet. However, it's essential to note that the device can handle higher surge currents for shorter durations, but this should be verified through simulation or testing.
Yes, the DNA30EM2200PZ-TRL can be used in a parallel configuration to increase current handling. However, it's crucial to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch between the devices.
Littelfuse recommends storing the DNA30EM2200PZ-TRL in a dry, cool place with a relative humidity of 50% or less. The devices should be stored in their original packaging or in a sealed bag with desiccant to prevent moisture absorption.
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DNA30EM2200PZ-TRL Overview
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