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DSEI60-10A - LITTELFUSE

Description: IXYS SEMICONDUCTOR - DSEI60-10A - DIODE, FAST, 65A

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Symbol
DSEI60-10A - LITTELFUSE - PCB symbol
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PCB Footprints
DSEI60-10A - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-AD
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3D Models
DSEI60-10A - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-247-AD
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DSEI60-10A Details

  • Manufacturer Part Number:

    DSEI60-10A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.02

  • Additional Feature:

    HIGH RELIABILITY, LOW NOISE, FREE WHEELING DIODE, SNUBBER DIODE

  • Application:

    FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    500 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    60 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    189 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DSEI60-10A Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DSEI60-10A is a rectangular pad with dimensions of 3.5mm x 2.5mm, with a 1.5mm diameter hole in the center for the thermal tab.
  • Yes, the DSEI60-10A is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder to the pads. Avoid applying excessive force or heat, which can damage the device.
  • The DSEI60-10A has a maximum surge current rating of 100A for 10ms, making it suitable for applications with high inrush currents.
  • Yes, the DSEI60-10A can be used in parallel to increase the current rating, but it is essential to ensure that the devices are properly matched and that the PCB layout is designed to minimize current imbalance and thermal mismatch.

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DSEI60-10A Overview

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