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EN6337QI - Intel

Description: Non-Isolated PoL Module DC DC Converter 1 Output 0.6 ~ 6.285V 3A 2.5V - 6.6V Input

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PCB Footprints
EN6337QI - Intel PCB footprint - Other - Other - EN6337QI-1
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EN6337QI - Intel  - 3D model - Other - EN6337QI-1
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EN6337QI Details

  • Manufacturer Part Number:

    EN6337QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-38

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.6V TO 6.285V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6.6 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-XQCC-N38

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC38,.16X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2300 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

EN6337QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Power sequencing should follow the recommended sequence: VCC, VCCP, and VTT. Voltage ramp-up should be controlled to avoid overshoot and ensure a monotonic rise.
  • Implement power gating, dynamic voltage and frequency scaling, and optimize the clock tree. Use the device's built-in power management features and consider using a low-power mode.
  • Use a multi-layer PCB with a solid ground plane, implement good signal routing practices, and consider using shielding and filtering components. Ensure proper decoupling and bypassing of power supplies.

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EN6337QI Overview

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