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EP5348UI - Intel

Description: Conv DC-DC 2.5V to 5.5V Step Down Single-Out 0.6V 0.4A 14-Pin UQFN T/R

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PCB Footprints
EP5348UI - Intel PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN14
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3D Models
EP5348UI - Intel  - 3D model - Quad Flat No-Lead - QFN14
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EP5348UI Details

  • Manufacturer Part Number:

    EP5348UI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.6V TO 5.188V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-XQCC-N14

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.4 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC14,.07X.09,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.95 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.75 mm

EP5348UI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from high-current paths and ensure good airflow around the device.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow management. Monitor temperature and adjust system design accordingly.
  • Lower input voltage may reduce output current capability and efficiency. Consult the datasheet for specific performance characteristics at lower input voltages.
  • Yes, but ensure proper synchronization and control mechanisms are implemented to prevent unwanted interactions between redundant units.
  • Use a systematic approach: check input voltage, output voltage, and current. Verify proper PCB layout, thermal management, and component selection. Consult the datasheet and application notes for guidance.

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EP5348UI Overview

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