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FDD4141-F085 - onsemi

Description: Max rDS(on) = 18.0mΩ at VGS = -4.5V, ID = -10.4A; Qualified to AEC Q101; Max rDS(on) = 12.3mΩ at VGS = -10V, ID = -12.7A; RoHS Compliant; High performance trench technology for extremely low rDS(on)

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FDD4141-F085 - onsemi PCB footprint - Other - Other - DPAK3 (TO−252 3 LD) CASE 369AS ISSUE O_7
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FDD4141-F085 Details

  • Manufacturer Part Number:

    FDD4141-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252 3L (DPAK)

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    337 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    10.8 A

  • Drain-source On Resistance-Max:

    0.0123 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    69 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDD4141-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the device to facilitate heat dissipation.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 5.5V). Use a high-quality decoupling capacitor (e.g., 10uF ceramic) close to the VIN pin. Also, ensure the output voltage (VOUT) is within the recommended range (0.8V to 3.3V) and use a suitable output capacitor (e.g., 22uF ceramic).
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for the input capacitor (CIN). This value provides a good balance between noise filtering and stability.
  • The enable pin (EN) is active-high. Connect it to a logic-high signal (e.g., VCC) to enable the device. When EN is low, the device is in shutdown mode, reducing quiescent current. Use a pull-up resistor (e.g., 10kΩ) to ensure a clear logic-high signal.
  • The FDD4141-F085 can deliver up to 1A of output current. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal considerations. Ensure the device is properly heatsinked and the output current is within the recommended range for reliable operation.

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FDD4141-F085 Overview

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