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GBJ2510 - HY Electronic

Description: HY Electronic Corp GBJ2510, Bridge Rectifier, 25A 1000V, 4-Pin GBJ

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GBJ2510 - HY Electronic PCB footprint - Other - Other - HY_GBJ
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GBJ2510 Details

  • Manufacturer Part Number:

    GBJ2510

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    HY Electronic Corp

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSFM-T4

  • Non-rep Pk Forward Current-Max:

    350 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

GBJ2510 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stackup with a dedicated ground plane, and to use thermal vias and a heat sink to dissipate heat. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal protection devices, such as thermistors or thermal fuses, to prevent overheating.
  • The recommended soldering conditions for the GBJ2510 are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It's also recommended to use a solder with a melting point of 217°C or higher.
  • To handle ESD protection, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding ESD protection devices, such as TVS diodes, to the PCB design.
  • The recommended storage and handling conditions for the GBJ2510 are: storage temperature of -40°C to 125°C, relative humidity of 60% or less, and protection from direct sunlight and moisture.

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GBJ2510 Overview

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Part Image GBJ2510-BP Micro Commercial Components

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Part Image GBJ2510 Micro Commercial Components

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Part Image GBJ2510 Lite-On Semiconductor Corporation

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Part Image GBJ2510 WEITRON INTERNATIONAL CO., LTD.

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