A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow.
Implement a heat sink with a thermal resistance of ≤ 10°C/W, and ensure good airflow around the device. Consider using a thermal interface material (TIM) for improved heat transfer.
The maximum allowed voltage on the enable pin (EN) is 5.5V. Exceeding this voltage may cause damage to the device.
While a lower value capacitor may work, it's not recommended. The specified 10uF capacitor ensures stable operation and minimizes output voltage ripple.
Check the PCB layout for noise coupling, ensure proper decoupling, and verify the input voltage is within the recommended range. Also, check for excessive output capacitance or incorrect component values.
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GS1MWG_R2_00001 Overview
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