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HCNR200-300E - Avago Technologies

Description: Optocoupler AC/DC i/p DC o/p PDIP8 W SMD Avago HCNR200-300E DC Input Photodiode Output Optocoupler, Surface Mount, 8-Pin PDIP-W

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HCNR200-300E - Avago Technologies - PCB symbol
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PCB Footprints
HCNR200-300E - Avago Technologies PCB footprint - Small Outline Packages - Small Outline Packages - Gull Wing Surface Mount Option #300
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3D Models
HCNR200-300E - Avago Technologies - 3D model - Small Outline Packages - Gull Wing Surface Mount Option #300
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HCNR200-300E Details

  • Manufacturer Part Number:

    HCNR200-300E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.4 INCH, ROHS COMPLIANT, SURFACE MOUNT, DIP-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Avago Technologies

  • Additional Feature:

    IEC-60747-5-5; UL RECOGNIZED

  • Configuration:

    DUAL, SIMULTANEOUS OPERATION

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    1.85 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    PHOTODIODE OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

HCNR200-300E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or a ferrite bead to filter the power supply.
  • Ensure good thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink. Operate the device within the recommended temperature range (0°C to 85°C).
  • Use a shielded enclosure and ensure good grounding. Keep the device away from sources of electromagnetic interference (EMI). Use EMI filters or ferrite beads on the input and output lines. Follow good PCB layout practices to minimize radiation.
  • Use an oscilloscope to check the input and output waveforms. Verify the power supply voltage and current. Check for proper grounding and shielding. Consult the datasheet and application notes for troubleshooting guidelines.
  • Ensure the device is operated within the recommended voltage and current ratings. Use protective devices such as fuses or circuit breakers to prevent overcurrent. Follow proper safety procedures when handling the device and PCB.

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HCNR200-300E Overview

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