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HCPL-7840 - Avago Technologies

Description: ISOLATION AMPLIFIER, 8 Pin, Plastic, DIP

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PCB Footprints
HCPL-7840 - Avago Technologies PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Pin Standard DIP
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3D Models
HCPL-7840 - Avago Technologies  - 3D model - Dual-In-Line Packages - 8-Pin Standard DIP
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HCPL-7840 Details

  • Manufacturer Part Number:

    HCPL-7840

  • Pbfree Code:

    No

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP, DIP8,.3

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    5

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Common Mode Voltage-Max:

    2.8 V

  • Isolation Voltage-Min:

    3750 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    15.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Max:

    8.4

  • Voltage Gain-Min:

    7.6

  • Width:

    7.62 mm

HCPL-7840 Frequently Asked Questions (FAQs)

  • A good PCB layout for HCPL-7840 involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable operation of HCPL-7840 in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • Common failure modes of HCPL-7840 include overvoltage, overcurrent, and excessive temperature. To mitigate these, ensure that the device is operated within the recommended voltage and current ranges, and provide adequate heat sinking and thermal management.
  • Yes, HCPL-7840 is suitable for high-reliability applications. It's designed to meet the requirements of IEC 60747-5-5 and has a high MTBF (mean time between failures) rating. However, it's essential to follow proper design and manufacturing practices to ensure the device operates reliably in these applications.
  • To troubleshoot issues with HCPL-7840, start by checking the input voltage and current, ensuring they are within the recommended ranges. Verify that the device is properly connected and that the PCB layout is correct. Use an oscilloscope to check the output waveform and voltage levels. If the issue persists, consult the datasheet and application notes for further guidance.

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HCPL-7840 Overview

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Part Image HCPL-7840#360 Avago Technologies

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Part Image HCPL-7840#E Avago Technologies

ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDIP8, LEAD FREE, DIP-8

Part Image HCPL-7840-E Broadcom Limited

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Part Image HCPL-7840-360 Agilent Technologies Inc

Isolation Amplifier, 1 Func, 3750V Isolation-Min, 0.1MHz Band Width, Hybrid, PDSO8

For a full list of alternate parts for HCPL-7840, check out Findchips.com