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HV2809K6-G - Microchip

Description: Analog Switch ICs 32Ch Analog Switch HV, Low Distortion

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Symbol
HV2809K6-G - Microchip - PCB symbol
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PCB Footprints
HV2809K6-G - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56-Lead QFN Package Outline (K6)_2025
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3D Models
HV2809K6-G - Microchip - 3D model - Quad Flat No-Lead - 56-Lead QFN Package Outline (K6)_2025
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HV2809K6-G Details

  • Manufacturer Part Number:

    HV2809K6-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    56

  • Manufacturer Package Code:

    VQFN-56

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Input Voltage-Max:

    -30 V

  • Input Voltage-Min:

    -30 V

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    8 mm

  • Neg Supply Voltage-Max (Vsup):

    -160 V

  • Neg Supply Voltage-Min (Vsup):

    -40 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    32

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Off-state Isolation-Nom:

    33 dB

  • On-state Resistance Match-Nom:

    1.25 Ω

  • On-state Resistance-Max (Ron):

    25 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Signal Current-Max:

    3 A

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    30000 ns

  • Switch-on Time-Max:

    30000 ns

  • Technology:

    HVCMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

HV2809K6-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV2809K6-G involves keeping the high-voltage traces short and away from sensitive analog signals. Use a solid ground plane and decouple the power supply with a 10uF capacitor. Refer to Microchip's application notes for more detailed guidelines.
  • To ensure reliable communication, use a dedicated SPI bus with a clock frequency of 1-5 MHz. Ensure proper signal termination, and use a pull-up resistor on the CS pin. Also, implement error checking and retries in your firmware to handle potential communication errors.
  • The HV2809K6-G can dissipate up to 2.5W of power. Ensure good airflow around the device, and consider using a heat sink or thermal pad to reduce the junction temperature. Keep the device away from other heat sources and ensure proper PCB thermal design.
  • Use a TVS diode or a zener diode to clamp overvoltage events. Add a series resistor to limit the current in case of an ESD event. Ensure that your PCB design follows good ESD protection practices, such as using a ground plane and minimizing signal trace lengths.
  • The internal voltage regulator is set to 5V by default. You can adjust the output voltage using the VREG pin. For optimal performance, set the output voltage to match your system's requirements, and ensure the input voltage is within the recommended range of 4.5V to 18V.

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HV2809K6-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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