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HV9803BLG-G - Microchip

Description: LED DRIVER ICWITH AVERAGE-MODE CONSTANT CURRENT CONTROL

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HV9803BLG-G - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD SOIC (LG/TG)
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HV9803BLG-G - Microchip  - 3D model - Small Outline Packages - 8-LEAD SOIC (LG/TG)
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HV9803BLG-G Details

  • Manufacturer Part Number:

    HV9803BLG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    16 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

HV9803BLG-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-voltage traces short and away from sensitive analog signals.
  • Use a soft-start circuit to limit the inrush current during startup. For shutdown, ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
  • Use a heat sink with a thermal resistance of <1°C/W. Ensure good airflow and keep the device away from other heat sources. Monitor the junction temperature (TJ) to prevent overheating.
  • Use a shielded enclosure, keep the high-voltage traces short, and use EMI filters or common-mode chokes to reduce emissions. Ensure the PCB layout is EMI-optimized.
  • Maintain a minimum creepage distance of 2.5 mm between high-voltage traces and other conductive paths. Use a suitable isolation material and ensure the PCB material meets the required CTI (comparative tracking index) rating.

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HV9803BLG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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