The recommended land pattern for the IHLP2020BZERR22M01 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP2020BZERR22M01 has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a thermal interface material (TIM) to improve heat transfer between the inductor and the PCB.
The recommended soldering profile for the IHLP2020BZERR22M01 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 217°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a potting compound to secure the inductor in place.
The ESR of the IHLP2020BZERR22M01 is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ based on similar inductors in the IHLP series.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
IHLP2020BZERR22M01 Overview
Use the download button to access the IHLP2020BZERR22M01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IHLP2,
or try a keyword search, such as Fixed Inductors
