Part Image

IHLP5050EZERR82M01 - Vishay

Description: --

Download IHLP5050EZERR82M01 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
IHLP5050EZERR82M01 - Vishay  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

IHLP5050EZERR82M01 Details

  • Manufacturer Part Number:

    IHLP5050EZERR82M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.8

  • Case/Size Code:

    5251

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0023 Ω

  • Inductance-Nom (L):

    0.82 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5 mm

  • Package Length:

    13.2 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    31 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050EZERR82M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050EZERR82M01 is a pad size of 5.5 mm x 5.5 mm with a non-solder mask defined (NSMD) pad shape.
  • The IHLP5050EZERR82M01 has a temperature rating of 155°C. To handle thermal derating, ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout guidelines to minimize thermal resistance.
  • The SRF of the IHLP5050EZERR82M01 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. Typically, the SRF is around 100-200 MHz for this inductor.
  • Yes, the IHLP5050EZERR82M01 is suitable for high-reliability applications. It is built with a rugged construction and has undergone rigorous testing to ensure its reliability in harsh environments.
  • To ensure magnetic shielding, keep the IHLP5050EZERR82M01 at least 2-3 mm away from other magnetic components, and use a shielded enclosure or a mu-metal shield if necessary.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

IHLP5050EZERR82M01 Overview

Use the download button to access the IHLP5050EZERR82M01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IHLP5, or try a keyword search, such as Fixed Inductors

Parts related to IHLP5050EZERR82M01

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview

IHLP5050EZERR82M01 Alternates

Showing results

Image Part Number Model
Part Image BMMA00131350R82MV1 YAGEO Corporation

General Purpose Inductor, 0.82uH, 20%, 1 Element, Powdered Metal-Core, SMD, 5251

Part Image BMMA00131350R82MV1 Pulse Electronics Corporation

General Purpose Inductor, 0.82uH, 20%, 1 Element, Magnetic-Core, SMD, 5251

Part Image BMMA00131350R82MX1 Pulse Electronics Corporation

General Purpose Inductor, 0.82uH, 20%, 1 Element, Magnetic-Core, SMD, 5251