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ILSB1206ER100K - Vishay

Description: 10 µH Shielded Multilayer Inductor 25 mA 1Ohm Max 1206 (3216 Metric), -55°C ~ 125°C

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ILSB1206ER100K - Vishay - PCB symbol
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PCB Footprints
ILSB1206ER100K - Vishay PCB footprint - Other - Other - 1206 (3216 Metric)_2025
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ILSB1206ER100K Details

  • Manufacturer Part Number:

    ILSB1206ER100K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.7

  • Case/Size Code:

    1206

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.025 A

  • Self Resonance Frequency:

    28 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    10%

ILSB1206ER100K Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ILSB1206ER100K is a rectangular pad with a size of 1.5 mm x 3.5 mm, with a solder mask clearance of 0.5 mm around the pad.
  • The ILSB1206ER100K has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources.
  • The recommended soldering profile for the ILSB1206ER100K is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. Use a solder with a melting point of 217°C or higher.
  • Yes, the ILSB1206ER100K is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability in harsh environments.
  • To ensure proper derating, follow the guidelines in the datasheet for temperature derating. For example, at 125°C, the maximum power rating is 50% of the rated power.

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ILSB1206ER100K Overview

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ILSB1206ER100K Alternates

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Part Image ILSB1206ER100K Vishay Dale

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Part Image CIL31Y100KAC Samsung Electro-Mechanics

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Part Image CIL31Y100KAE Samsung Electro-Mechanics

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