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IR2010STRPBF - Infineon

Description: INFINEON - IR2010STRPBF - MOSFET Driver, High Side and Low Side, 10 V to 20 V Supply, 3 A Peak Out, 95 ns Delay, SOIC-16

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IR2010STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead SOIC-ren2
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IR2010STRPBF - Infineon  - 3D model - Small Outline Packages - 16-Lead SOIC-ren2
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IR2010STRPBF Details

  • Manufacturer Part Number:

    IR2010STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    220 V

  • Supply Voltage1-Min:

    6 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.105 µs

  • Turn-on Time:

    0.135 µs

  • Width:

    7.5 mm

IR2010STRPBF Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The maximum allowed voltage on the bootstrap capacitor is 35 V. Exceeding this voltage may damage the device.
  • While the recommended bootstrap capacitor value is 100 nF, values between 47 nF and 220 nF can be used. However, this may affect the device's performance and stability.
  • Check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is properly connected and that the device is not overheating. Consult the datasheet for specific troubleshooting guidelines.

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IR2010STRPBF Overview

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