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IR21064STRPBF - Infineon

Description: Driver 600V 0.35A 2-OUT High and Low Side Non-Inv 14-Pin SOIC N T/R

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IR21064STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead SOIC
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IR21064STRPBF - Infineon  - 3D model - Small Outline Packages - 14-Lead SOIC
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IR21064STRPBF Details

  • Manufacturer Part Number:

    IR21064STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.28 µs

  • Turn-on Time:

    0.3 µs

  • Width:

    3.9 mm

IR21064STRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The PCB should also have a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials to improve heat transfer between the device and the heat sink.
  • To ensure EMI and EMC compliance, it's crucial to follow proper PCB layout and design guidelines, use shielding and filtering where necessary, and ensure that the device is properly decoupled from the power supply. Additionally, consider using EMI filters and common-mode chokes to reduce electromagnetic interference.
  • To troubleshoot issues with the device's output voltage regulation, start by checking the input voltage, output voltage, and current sense resistors. Verify that the device is properly configured and that the output voltage is within the specified range. Check for any signs of overheating, and ensure that the device is properly cooled.
  • To prevent damage to the device, it's essential to follow proper storage and handling procedures. Store the device in a cool, dry place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static wrist straps and mats to prevent electrostatic discharge.

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IR21064STRPBF Overview

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