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IR3473MTRPBF - Infineon

Description: INFINEON - IR3473MTRPBF - DC/DC CONV, POL, 6A, BUCK, QFN-17

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IR3473MTRPBF - Infineon PCB footprint - Other - Other - PQFN-24L
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IR3473MTRPBF - Infineon  - 3D model - Other - PQFN-24L
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IR3473MTRPBF Details

  • Manufacturer Part Number:

    IR3473MTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    4 X 5 MM, LEAD FREE, QFN-17

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.5 TO 12V; PWM CONTROL TECHNIQUE ALSO POSSIBLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    HYSTERETIC CURRENT MODE

  • Input Voltage-Max:

    27 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N17

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    17

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC17(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    750 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

IR3473MTRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • Critical components include the input capacitors, output inductors, and output capacitors. Ensure that these components are selected based on the specific application requirements and follow the recommended component values and layout guidelines.
  • Use an oscilloscope to monitor the input and output voltages, and check for any signs of oscillation or instability. Verify that the device is properly soldered and that the PCB layout follows the recommended guidelines. Also, check the input voltage, output current, and thermal conditions to ensure they are within the recommended operating ranges.
  • Yes, the IR3473MTRPBF is suitable for high-reliability and safety-critical applications. However, it is essential to follow the recommended design guidelines, and ensure that the device is properly qualified and validated for the specific application.

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IR3473MTRPBF Overview

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