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IRS24531DSTRPBF - Infineon

Description: Driver 600V 0.26A 4-OUT High and Low Side Full Brdg Inv/Non-Inv 14-Pin SOIC N T/R

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IRS24531DSTRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14 lead soic
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IRS24531DSTRPBF Details

  • Manufacturer Part Number:

    IRS24531DSTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    FULL BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.26 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    16.6 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    14 V

  • Supply Voltage1-Max:

    600 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

IRS24531DSTRPBF Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN-1123, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using thermal interface materials and following proper soldering techniques.
  • Using a different gate driver IC may affect the performance and reliability of the IRS24531DSTRPBF. The recommended gate driver IC is optimized for the specific requirements of the IRS24531DSTRPBF, so using a different IC may require additional design considerations and may impact the overall system performance.
  • To troubleshoot issues with the IRS24531DSTRPBF, start by reviewing the application circuit and ensuring that it meets the recommended operating conditions. Check for proper thermal management, correct component placement, and adequate power supply decoupling. Use oscilloscopes and logic analyzers to monitor the device's behavior and identify potential issues. Consult Infineon's application notes and technical support resources for further guidance.
  • The IRS24531DSTRPBF is designed to withstand certain voltage transients and surges, but it's essential to ensure that the device is properly protected against excessive voltage spikes. Use TVS diodes, surge protectors, or other protection devices to prevent damage to the IRS24531DSTRPBF and ensure reliable operation.

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IRS24531DSTRPBF Overview

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