IS61NLP51236-200B3LI - Integrated Silicon Solution Inc.

IS61NLP51236-200B3LI Details

• Manufacturer Part Number:

  IS61NLP51236-200B3LI

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, TFBGA-165

• Pin Count:

  165

• Country Of Origin:

  Mainland China, Taiwan

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  Integrated Silicon Solution Inc

• YTEOL:

  5.87

• Access Time-Max:

  3.1 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  200 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B165

• Length:

  15 mm

• Memory Density:

  18874368 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  36

• Number of Functions:

  1

• Number of Terminals:

  165

• Number of Words:

  524288 words

• Number of Words Code:

  512000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512KX36

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA165,11X15,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Standby Current-Max:

  0.075 A

• Standby Voltage-Min:

  3.14 V

• Supply Current-Max:

  0.475 mA

• Supply Voltage-Max (Vsup):

  3.465 V

• Supply Voltage-Min (Vsup):

  3.135 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  13 mm