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ISL84684IUZ-T - Renesas Electronics

Description: The Intersil ISL84684 device is a low ON-resistance, low voltage, bidirectional, dual single-pole/double-throw (SPDT) analog switch designed to operate from a single +1. 65V to +3. 6V supply. Targeted applications include battery powered equipment that benefits from low rON (0. 35Ω) and fast switching speeds (tON = 50ns, tOFF = 27ns). The digital logic input is 1. 8V logic-compatible when using a single +3V supply. Cell phones, for example, often face ASIC functionality limitations. The number of analog inp

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ISL84684IUZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 10 Ld MSOP Tape and Reel (Pb-free)
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ISL84684IUZ-T - Renesas Electronics  - 3D model - Small Outline Packages - 10 Ld MSOP Tape and Reel (Pb-free)
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ISL84684IUZ-T Details

  • Manufacturer Part Number:

    ISL84684IUZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    M10.118

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    62 dB

  • On-state Resistance Match-Nom:

    0.055 Ω

  • On-state Resistance-Max (Ron):

    0.5 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL84684IUZ-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the ISL84684IUZ-T evaluation board user manual, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The ISL84684IUZ-T has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane. Additionally, the device's thermal resistance (θJA) is specified in the datasheet, which can be used to estimate the junction temperature.
  • The recommended input capacitor value and type depend on the specific application and operating conditions. However, as a general guideline, a 10uF to 22uF ceramic capacitor with an X7R or X5R dielectric is recommended for most applications. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
  • The ISL84684IUZ-T has a power-good output (PG) that indicates when the output voltage is within regulation. The device can be powered up and down by controlling the input voltage (VIN) and ensuring that the enable input (EN) is high during operation. A soft-start circuit can also be implemented to control the output voltage rise time during power-up.
  • The ISL84684IUZ-T has a maximum output current capability of 4A, but this can be limited by the thermal performance of the device and the PCB. The device's thermal performance and output current capability can be estimated using the thermal resistance (θJA) and the maximum junction temperature (TJ) specified in the datasheet.

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