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ISL97634IRT14Z-TK - Renesas Electronics

Description: The ISL97634 represents an efficient and highly integrated PWM boost LED driver that is suitable for LED backlighting in small size LCD panels. With integrated Schottky diode, OVP, and wide range of PWM dimming capability, the ISL97634 provides a simple, reliable, and flexible solution to the backlight designers. The ISL97634 features a wide range of PWM dimming control capability. It allows dimming frequency as low as DC to 32kHz beyond audible spectrum. The ISL97634 also features a feedback disconnect swi

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ISL97634IRT14Z-TK - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.2x3A
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ISL97634IRT14Z-TK - Renesas Electronics  - 3D model - Small Outline No-lead - L8.2x3A
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ISL97634IRT14Z-TK Details

  • Manufacturer Part Number:

    ISL97634IRT14Z-TK

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.2X3A

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

  • fmax-Min:

    0.32 MHz

ISL97634IRT14Z-TK Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-layer or 4-layer board, and minimizing the distance between the device and the thermal pad or heat sink. Additionally, using thermal vias and a solid ground plane can help to dissipate heat efficiently.
  • To ensure the device operates within the recommended operating conditions, it's essential to follow the recommended voltage and current ratings, as well as the thermal management guidelines outlined in the datasheet. Additionally, ensure that the input voltage is within the specified range, and the output current does not exceed the maximum rating.
  • The critical components that affect the device's efficiency include the input capacitor, output capacitor, and inductor. The selection of these components can significantly impact the device's efficiency, and it's essential to follow the recommended component values and types outlined in the datasheet.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and output current. Verify that the device is operating within the recommended operating conditions, and check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for any unusual voltage or current waveforms, and consult the datasheet for troubleshooting guidelines.
  • To mitigate EMI issues, use a shielded inductor, place the device away from sensitive analog circuits, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, ensure that the PCB layout is optimized for EMI reduction, and consider using EMI-absorbing materials or shielding on the PCB.

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ISL97634IRT14Z-TK Overview

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