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IXDN604SIA - LITTELFUSE

Description: Gate Drivers 4A Dual Low-Side Ultrafast Mosfet DRV

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Symbol
IXDN604SIA - LITTELFUSE - PCB symbol
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PCB Footprints
IXDN604SIA - LITTELFUSE PCB footprint - Small Outline Packages - Small Outline Packages - SIA (8-PIN SOIC)
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3D Models
IXDN604SIA - LITTELFUSE - 3D model - Small Outline Packages - SIA (8-PIN SOIC)
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IXDN604SIA Details

  • Manufacturer Part Number:

    IXDN604SIA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.01 mA

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.065 µs

  • Turn-on Time:

    0.065 µs

  • Width:

    3.9 mm

IXDN604SIA Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXDN604SIA is a standard SOT-23 package with a 1.5mm x 1.5mm pad size, and a 0.5mm x 0.5mm thermal pad.
  • Yes, IXDN604SIA is rated for operation up to 150°C, making it suitable for high-temperature applications. However, derating may be necessary for prolonged exposure to high temperatures.
  • To ensure reliable operation in high-vibration environments, it is recommended to use a secure mounting method, such as soldering or using a clip, and to follow proper PCB design and layout guidelines to minimize stress on the component.
  • IXDN604SIA is rated for a maximum surge current of 100A, making it suitable for applications where high surge currents may be present.
  • Yes, IXDN604SIA can be used in parallel to increase current handling, but it is recommended to ensure that the devices are properly matched and that the PCB design and layout are suitable for parallel operation.

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IXDN604SIA Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like IXDN6, or try a keyword search, such as MOSFET Drivers

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