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IXDN614SITR - LITTELFUSE

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IXDN614SITR - LITTELFUSE  - 3D model
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IXDN614SITR Details

  • Manufacturer Part Number:

    IXDN614SITR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    14 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    3.9 mm

IXDN614SITR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can also improve thermal performance.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided by Littelfuse Inc. Additionally, use a solder with a high melting point and a flux that is compatible with the device's package material. Visual inspection and X-ray inspection can also be used to verify the quality of the solder joint.
  • Exceeding the maximum junction temperature can lead to a reduction in the device's lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain its performance and reliability.
  • The IXDN614SITR is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. It is recommended to consult with Littelfuse Inc or a qualified engineer to determine if this device meets the necessary standards and requirements for such applications.
  • To prevent electrostatic discharge (ESD) damage, it is recommended to handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Additionally, ensure that the device is stored in a protective package and that the PCB is designed with ESD protection in mind.

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IXDN614SITR Overview

Use the download button to access the IXDN614SITR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXDN6, or try a keyword search, such as MOSFET Drivers

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