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IXFB44N100Q3 - LITTELFUSE

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IXFB44N100Q3 Details

  • Manufacturer Part Number:

    IXFB44N100Q3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    4000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1000 V

  • Drain Current-Max (ID):

    44 A

  • Drain-source On Resistance-Max:

    0.22 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    86 pF

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1560 W

  • Pulsed Drain Current-Max (IDM):

    110 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFB44N100Q3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFB44N100Q3 is a TO-220 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm. It's recommended to follow the manufacturer's recommended land pattern to ensure proper thermal performance and reliability.
  • To ensure proper cooling, it's recommended to provide a heat sink with a thermal resistance of less than 1°C/W and a surface area of at least 10cm². Additionally, ensure good airflow around the device and avoid blocking the heat sink fins. You can also consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The maximum allowed case temperature for the IXFB44N100Q3 is 150°C. Operating the device above this temperature can reduce its reliability and lifespan. It's recommended to design your system to keep the case temperature below 125°C to ensure optimal performance and reliability.
  • While the IXFB44N100Q3 is a fast-switching IGBT, it's not recommended for high-frequency switching applications above 50 kHz. The device is optimized for switching frequencies up to 20 kHz, and operating it at higher frequencies can increase losses and reduce its reliability.
  • To protect the IXFB44N100Q3 from overvoltage and overcurrent conditions, it's recommended to use a voltage clamp or a surge protector to limit the voltage across the device. Additionally, consider using a current sense resistor and a fault detection circuit to detect overcurrent conditions and shut down the device if necessary.

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IXFB44N100Q3 Overview

Use the download button to access the IXFB44N100Q3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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