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IXFH90N20X3 - LITTELFUSE

Description: N-Channel 200 V 90A (Tc) 390W (Tc) Through Hole TO-247 (IXTH)

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PCB Footprints
IXFH90N20X3 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247_2023-2
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3D Models
IXFH90N20X3 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247_2023-2
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IXFH90N20X3 Details

  • Manufacturer Part Number:

    IXFH90N20X3

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1500 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    90 A

  • Drain-source On Resistance-Max:

    0.0128 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    4 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    390 W

  • Pulsed Drain Current-Max (IDM):

    220 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXFH90N20X3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXFH90N20X3 is a 90A power module footprint with a minimum pad size of 3.5mm x 3.5mm and a maximum pad size of 5mm x 5mm, with a 1.5mm hole for the screw terminal.
  • Yes, the IXFH90N20X3 can be used in parallel to increase current handling, but it is recommended to use a master-slave configuration with a current sense resistor to ensure equal current sharing between devices.
  • The thermal resistance of the IXFH90N20X3 is Rth(j-c) = 0.35°C/W and Rth(c-s) = 0.15°C/W, which means it can handle high power dissipation with proper heat sinking.
  • Yes, the IXFH90N20X3 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
  • The recommended torque for the screw terminal of the IXFH90N20X3 is 1.5 Nm to 2.5 Nm, to ensure secure connection and prevent overheating.

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IXFH90N20X3 Overview

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