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IXTQ52P10P - LITTELFUSE

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IXTQ52P10P - LITTELFUSE  - 3D model
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IXTQ52P10P Details

  • Manufacturer Part Number:

    IXTQ52P10P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.3

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    52 A

  • Drain-source On Resistance-Max:

    0.05 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    275 pF

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IXTQ52P10P Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTQ52P10P is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the IXTQ52P10P is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the PCB and surrounding components can also withstand the high temperatures.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device, and avoid applying excessive force or pressure during the soldering process.
  • Store the IXTQ52P10P in a dry, cool place, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or pads to prevent damage from electrostatic discharge (ESD). Use anti-static packaging and follow proper ESD handling procedures when handling the devices.
  • Yes, the IXTQ52P10P is designed to withstand high surge currents. It has a high surge current rating of 100A, making it suitable for applications that require protection against high-energy surges.

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IXTQ52P10P Overview

Use the download button to access the IXTQ52P10P 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXTQ5, or try a keyword search, such as Power Field-Effect Transistors

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