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KLM8G1GESD-B04P
- SAMSUNG
Description:
SAMSUNG eMMC
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Part Number
KLM8G1GESD-B04P
Manufacturer
SAMSUNG
Pin Count
153
Part Category
Integrated Circuit
Package Category
BGA
Footprint Name
BGA - 11.5mm x 13mm x 0.8mm
Released Date
Apr 6, 2020
Last Modified Date
Mar 7, 2023 4:10 PM UTC
Pinout / Pin List
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KLM8G1GESD-B04P Details
Manufacturer Part Number:
KLM8G1GESD-B04P
Manufacturer:
Samsung Electro-Mechanics
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KLM8G1GESD-B04P Overview
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