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KLM8G1GETF-B0410 - SAMSUNG

Description: MLC NAND Flash Serial e-MMC 64G-bit 64G x 1

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Symbol

KLM8G1GETF-B0410 - SAMSUNG - PCB symbol

PCB Footprints

KLM8G1GETF-B0410 - SAMSUNG PCB footprint - BGA - BGA - 153FBGA

3D Models

KLM8G1GETF-B0410 - SAMSUNG - 3D model - BGA - 153FBGA

Datasheet Download Datasheet
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Part Number KLM8G1GETF-B0410
Manufacturer SAMSUNG
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153FBGA
Released Date Nov 20, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

KLM8G1GETF-B0410 Details

Manufacturer Part Number:
KLM8G1GETF-B0410
Manufacturer:
Samsung Electro-Mechanics

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