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LT6203XS8#TRPBF - Analog Devices

Description: High Temperature 175?C Dual 100MHz, Rail-to-Rail Input and Output, Ultralow 1.9nV/??Hz Noise, Low Power Op Amp

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LT6203XS8#TRPBF - Analog Devices - PCB symbol
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LT6203XS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8 Package 8-Lead
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LT6203XS8#TRPBF - Analog Devices - 3D model - Small Outline Packages - S8 Package 8-Lead
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LT6203XS8#TRPBF Details

  • Manufacturer Part Number:

    LT6203XS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    12 µA

  • Bias Current-Max (IIB) @25C:

    3 µA

  • Common-mode Reject Ratio-Min:

    79 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    NO

  • Input Offset Current-Max (IIO):

    0.0091 µA

  • Input Offset Voltage-Max:

    9100 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -12.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.752 mm

  • Slew Rate-Min:

    13 V/us

  • Slew Rate-Nom:

    18 V/us

  • Supply Current-Max:

    12.6 mA

  • Supply Voltage Limit-Max:

    12.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    90000

  • Voltage Gain-Min:

    70000

  • Wideband:

    YES

  • Width:

    3.9 mm

LT6203XS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6203XS8 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions. A stability analysis using tools like SPICE or MATLAB can also be performed to verify the stability of the device in the specific application.
  • The maximum power dissipation of the LT6203XS8 is dependent on the package type and the ambient temperature. For the XS8 package, the maximum power dissipation is approximately 1.4W. To calculate the power dissipation, you need to consider the voltage drop across the device, the output current, and the ambient temperature. The datasheet provides a power dissipation calculation formula and a thermal resistance value that can be used to estimate the junction temperature.
  • The LT6203XS8 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. The datasheet provides a temperature derating curve that shows the maximum allowed power dissipation at different temperatures. It's essential to ensure that the device operates within its recommended operating conditions and that the junction temperature is kept below the maximum rating.
  • The LT6203XS8 has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Additionally, the device should be protected from other transient events such as voltage spikes and surges using external protection components like TVS diodes or zener diodes. A good PCB layout and proper grounding can also help to reduce the risk of ESD and transient damage.

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LT6203XS8#TRPBF Overview

Use the download button to access the LT6203XS8#TRPBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LT620, or try a keyword search, such as Operational Amplifiers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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