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LTC1658CMS8#TRPBF - Analog Devices

Description: Digital to Analog Converters - DAC 14-bit Micropower DAC in MSOP Package

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LTC1658CMS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (LTC DWG # 05-08-1660)_1
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LTC1658CMS8#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (LTC DWG # 05-08-1660)_1
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LTC1658CMS8#TRPBF Details

  • Manufacturer Part Number:

    LTC1658CMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0488%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Nom (tstl):

    12 µs

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC1658CMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC1658CMS8#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and parasitic inductance. A 4-layer PCB with a dedicated analog ground layer is recommended.
  • To ensure accurate temperature measurement, it's essential to calibrate the device, use a high-accuracy voltage reference, and minimize thermal gradients on the PCB. Additionally, consider using a thermocouple or other temperature sensor with a high accuracy rating.
  • The LTC1658CMS8#TRPBF has an operating temperature range of -40°C to 125°C, but the device's accuracy and performance may degrade at extreme temperatures. It's essential to consult the datasheet and application notes for specific temperature-related limitations.
  • The LTC1658CMS8#TRPBF is a surface-mount device and can be susceptible to vibration and shock. To ensure reliability, it's recommended to use a robust PCB design, secure the device with a suitable adhesive or mechanical fastening, and consider using a vibration-resistant mounting method.
  • To troubleshoot issues with the LTC1658CMS8#TRPBF, start by verifying the power supply and voltage references, checking the PCB layout and connections, and ensuring that the device is properly configured and calibrated. Consult the datasheet, application notes, and Analog Devices' support resources for guidance on specific troubleshooting steps.

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LTC1658CMS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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