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LTC4307CMS8#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC4307CMS8#PBF - Hot Swap Bus Buffer, 2.3V to 5.5V supply, 160 mV output, MSOP-8

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LTC4307CMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 8
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LTC4307CMS8#PBF Details

  • Manufacturer Part Number:

    LTC4307CMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4307CMS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4307 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliable hot swap operation, make sure to follow the recommended PCB layout, use a suitable hot swap controller, and ensure that the power supply is stable and well-regulated. Additionally, consider using a soft-start circuit to limit the inrush current during hot swap events.
  • The LTC4307 has a maximum junction temperature of 125°C. To ensure reliable operation at high temperatures, make sure to provide adequate heat sinking, use a thermally conductive PCB material, and consider using a heat sink or thermal interface material. Additionally, ensure that the device is operated within its recommended operating conditions.
  • To troubleshoot issues with the LTC4307, start by checking the power supply voltage, input voltage, and output voltage. Verify that the device is properly configured and that the input and output capacitors are properly sized. Use an oscilloscope to check for any unusual voltage or current waveforms. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • Yes, the LTC4307 can be used in a redundant or fault-tolerant system. To ensure reliable operation, make sure to follow the recommended PCB layout, use suitable redundancy and fault-tolerance techniques, and consider using a redundant power supply. Additionally, ensure that the system is designed to handle faults and failures, and that the LTC4307 is properly configured and monitored.

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LTC4307CMS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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