15 X 15 MM, 4.32 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-113
Pin Count:
113
Manufacturer Package Code:
05-08-1756
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
10
Additional Feature:
ALSO OPERATES IN ADJUSTABLE MODE FROM 2.5V TO 24V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
60 V
Input Voltage-Min:
4.5 V
Input Voltage-Nom:
20 V
JESD-30 Code:
S-PBGA-N113
JESD-609 Code:
e4
Length:
15 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
113
Operating Temperature-Max:
125 °C
Output Current-Max:
4 A
Output Voltage-Max:
24 V
Output Voltage-Min:
2.5 V
Output Voltage-Nom:
12 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
LGA
Package Equivalence Code:
LGA113,11X11,50
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Seated Height-Max:
4.42 mm
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
500 kHz
Technology:
HYBRID
Temperature Grade:
OTHER
Terminal Finish:
Gold (Au)
Terminal Form:
NO LEAD
Terminal Pitch:
1.27 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
15 mm
LTM8027EV#PBF Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Use a soft-start circuit to limit the inrush current during start-up, and ensure a controlled shutdown sequence to prevent voltage spikes and oscillations.
Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Ensure that the filter components are placed close to the device and connected to a solid ground plane.
Use a low-noise, low-ESR input capacitor, and ensure that the device is operated within its recommended input voltage range. Additionally, use a high-PSRR capacitor in the output filter to minimize noise and ripple.
Ensure good thermal contact between the device and the heat sink, and use a thermal interface material (TIM) to fill any gaps. The heat sink should be designed to dissipate heat efficiently, with a thermal resistance of <1°C/W.
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LTM8027EV#PBF Overview
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About Analog Devices
Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries.
Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.
