ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure stable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a heat sink if necessary, and consider derating the device's power consumption according to the temperature derating curve provided in the datasheet.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.
The LTR18EZPF8202 is not designed for use in high-humidity environments. If you need to operate the device in a humid environment, consider using a conformal coating or potting the device to prevent moisture ingress.
ROHM recommends storing the LTR18EZPF8202 in a dry, dark place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.
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