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MAX13175EETU+ - Analog Devices

Description: Interface - Specialised Multiprotocol, Pin-Selectable Data Interface Chipset

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MAX13175EETU+ - Analog Devices - PCB symbol
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PCB Footprints
MAX13175EETU+ - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MAX13171EETU+T
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3D Models
MAX13175EETU+ - Analog Devices - 3D model - Quad Flat No-Lead - MAX13171EETU+T
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MAX13175EETU+ Details

  • Manufacturer Part Number:

    MAX13175EETU+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    38-LFCSP-5X7X0.75

  • Package Description:

    7 X 5 MM, ROHS COMPLIANT, TQFN-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    38-LFCSP-5X7X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2009-08-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.10; V.11; V.28; V.35; V.36; X.21; EIA-449; EIA-530

  • JESD-30 Code:

    R-XQCC-N38

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC38,.2X.28,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2000 ns

  • Width:

    5 mm

MAX13175EETU+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX13175EETU+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
  • The MAX13175EETU+ has a thermal pad that should be connected to a solid ground plane to dissipate heat. In high-power applications, it's recommended to use a heat sink or a thermal interface material to improve heat dissipation. Additionally, ensure good airflow around the device and avoid blocking the airflow with other components.
  • A recommended input filter configuration for the MAX13175EETU+ involves using a pi-filter (R-C-R) or a T-filter (L-C-L) with a cutoff frequency of around 100 kHz to 1 MHz. This helps to filter out high-frequency noise and interference, ensuring a clean input signal to the device.
  • To troubleshoot common issues with the MAX13175EETU+, start by checking the input voltage, output voltage, and current sense resistor values. Ensure that the device is properly configured and that the input filter is correctly implemented. Use an oscilloscope to check for oscillations or noise on the output voltage. If issues persist, consult the datasheet and application notes for guidance.
  • To prevent ESD damage to the MAX13175EETU+, handle the device by the body or pins, avoid touching the pins, and use an ESD wrist strap or mat during assembly. Ensure that the PCB and components are properly grounded, and use ESD-protected packaging and storage materials.

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MAX13175EETU+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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