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MAX3053ESA+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3053ESA+T - CAN TRANSCEIVER, 2MBPS, 5V, NSOIC-8

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MAX3053ESA+T - Analog Devices - PCB symbol
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PCB Footprints
MAX3053ESA+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 21-0041
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MAX3053ESA+T - Analog Devices - 3D model - Small Outline Packages - 21-0041
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MAX3053ESA+T Details

  • Manufacturer Part Number:

    MAX3053ESA+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2002-05-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3053ESA+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3053ESA+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals under the device.
  • The MAX3053ESA+T has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure that the thermal pad is soldered to the PCB and that the PCB has sufficient thermal conductivity. Additionally, consider using thermal vias to improve heat dissipation.
  • The recommended input impedance for the MAX3053ESA+T is 50 ohms. This ensures that the device can accurately measure the input signal and maintain its specified performance.
  • The MAX3053ESA+T is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, consider using a heat sink or a thermal management system to keep the device within its specified operating temperature range.
  • The MAX3053ESA+T does not require calibration, as it is a self-contained device with internal calibration. However, you may need to adjust the device's gain and offset settings depending on your specific application requirements.

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MAX3053ESA+T Overview

Use the download button to access the MAX3053ESA+T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MAX30, or try a keyword search, such as Network Interfaces

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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