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MAX31740ATA+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX31740ATA+ - FAN SPEED CONTROLLER, TDFN-8

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MAX31740ATA+ - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - MAX31740ATA+
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MAX31740ATA+ - Analog Devices  - 3D model - Small Outline No-lead - MAX31740ATA+
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MAX31740ATA+ Details

  • Manufacturer Part Number:

    MAX31740ATA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-LFCSP-2X3X0.75

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-LFCSP-2X3X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2013-06-20

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

MAX31740ATA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX31740ATA+ involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Choose input and output capacitors with low ESR (Equivalent Series Resistance) and high ripple current ratings. X5R or X7R ceramic capacitors with a voltage rating of at least 2x the input voltage are recommended. The output capacitor should be at least 10uF with a voltage rating of at least 2x the output voltage.
  • The MAX31740ATA+ has an operating ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
  • Yes, the MAX31740ATA+ is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly soldered and the PCB is securely fastened to the system to prevent mechanical stress and vibration-induced failures.
  • Common issues with the MAX31740ATA+ include output voltage instability, overheating, and shutdown. To troubleshoot these issues, check the input voltage, output load, and PCB layout. Ensure that the input and output capacitors are properly selected and the device is operated within its recommended specifications.

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MAX31740ATA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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