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MAX3738ETG+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3738ETG+T - Laser Diode Driver, SFP/SFF Optical Modules, 4.25Gbps, 2.97V to 3.63V, TQFN-24

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MAX3738ETG+T - Analog Devices - PCB symbol
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PCB Footprints
MAX3738ETG+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 21-0139 (T2444-4C)
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3D Models
MAX3738ETG+T - Analog Devices - 3D model - Quad Flat No-Lead - 21-0139 (T2444-4C)
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MAX3738ETG+T Details

  • Manufacturer Part Number:

    MAX3738ETG+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    24-LFCSP-4X4X0.75

  • Package Description:

    HVQCCN, LCC24,.16SQ,20

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-4X4X0.75

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-02-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

MAX3738ETG+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3738ETG+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down, the MAX3738ETG+T requires a controlled power supply sequence. The VCC pin should be powered up before the VEE pin, and the VEE pin should be powered down before the VCC pin. Additionally, the EN pin should be pulled high after VCC is stable.
  • The MAX3738ETG+T can support data rates up to 3.2 Gbps, but the actual data rate achievable depends on the specific application, PCB layout, and signal integrity.
  • To troubleshoot issues with the MAX3738ETG+T, use a combination of tools such as oscilloscopes, signal generators, and logic analyzers to analyze the signal waveforms and timing. Also, check the power supply voltage and current, and ensure that the device is properly powered up and powered down.
  • Yes, the MAX3738ETG+T has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be mounted on a PCB with a good thermal conductivity, and a heat sink may be required for high-power applications.

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MAX3738ETG+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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