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MAX3747BEUB+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX3747BEUB+T - Limiting Amplifier, 155Mbps to 3.2Gbps, 2.97 V, 3.63 V, µMAX, 10 Pins, -40 °C

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PCB Footprints
MAX3747BEUB+T - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - U10+5-1
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MAX3747BEUB+T - Analog Devices  - 3D model - Small Outline Packages - U10+5-1
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MAX3747BEUB+T Details

  • Manufacturer Part Number:

    MAX3747BEUB+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    10-MINI_SO-N/A

  • Pin Count:

    10

  • Manufacturer Package Code:

    10-MINI_SO-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2004-06-02

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Current-Max:

    43 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX3747BEUB+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3747BEUB+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper power-up and power-down of the MAX3747BEUB+T, make sure to follow the recommended power-up sequence, which is to apply VCC first, followed by VEE. During power-down, remove VEE first, followed by VCC. Also, ensure that the input signals are stable and within the recommended voltage range before applying power.
  • The MAX3747BEUB+T can support data rates up to 3.2Gbps, but the actual data rate achievable depends on the specific application, PCB layout, and signal quality. It's recommended to consult the datasheet and application notes for more information on achieving high-speed data transmission.
  • To troubleshoot issues with the MAX3747BEUB+T, use a combination of tools such as oscilloscopes, signal generators, and logic analyzers to analyze the signal waveforms and power supply noise. Also, consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • Yes, the MAX3747BEUB+T can be used in a hot-swap application, but it's essential to follow proper hot-swap design guidelines to ensure reliable operation. This includes using proper power sequencing, decoupling, and signal conditioning to prevent damage to the device or other components during hot-swap events.

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MAX3747BEUB+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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