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MRF1511NT1 - NXP

Description: RF MOSFET Transistors RF LDMOS FET PLD1.5N

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PCB Footprints
MRF1511NT1 - NXP PCB footprint - Other - Other - CASE 466-03, STYLE 1 PLD-1.5
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3D Models
MRF1511NT1 - NXP  - 3D model - Other - CASE 466-03, STYLE 1 PLD-1.5
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MRF1511NT1 Details

  • Manufacturer Part Number:

    MRF1511NT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, PLD-1.5, CASE 466-03, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    4 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    8 pF

  • Highest Frequency Band:

    VERY HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    62.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MRF1511NT1 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN5071, which includes guidelines for component placement, trace routing, and thermal management.
  • To optimize the MRF1511NT1 for high-power applications, ensure proper thermal management by using a heat sink, optimize the PCB layout for thermal dissipation, and consider using a thermal interface material. Additionally, follow the recommended operating conditions and derating guidelines in the datasheet.
  • The MRF1511NT1 is designed to operate up to 1.5 GHz, but the maximum operating frequency may vary depending on the specific application and operating conditions. Consult the datasheet and application notes for more information.
  • Common issues with the MRF1511NT1 include overheating, oscillation, and poor RF performance. Troubleshoot by checking the PCB layout, thermal management, and operating conditions. Consult the datasheet, application notes, and NXP's technical support resources for more information.
  • NXP provides a list of recommended components, including capacitors, resistors, and inductors, in the application note AN5071. These components are optimized for use with the MRF1511NT1 and can help ensure optimal performance.

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MRF1511NT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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RF Power Field-Effect Transistor, 1-Element, Very High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET