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MRFE6VS25NR1 - NXP

Description: RF MOSFET Transistors VHV6E 25W50V TO270-2

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MRFE6VS25NR1 - NXP  - 3D model
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MRFE6VS25NR1 Details

  • Manufacturer Part Number:

    MRFE6VS25NR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    133 V

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    0.26 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDFM-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    25 W

  • Power Gain-Min (Gp):

    24 dB

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MRFE6VS25NR1 Frequently Asked Questions (FAQs)

  • The MRFE6VS25NR1 is designed to operate up to 2.7 GHz, making it suitable for applications such as wireless infrastructure, satellite communications, and radar systems.
  • To optimize biasing, ensure that the gate voltage (Vgs) is set between -2.5 V and -0.5 V, and the drain voltage (Vds) is set between 20 V and 28 V. Additionally, adjust the quiescent current (Idq) to the recommended value of 100 mA to achieve optimal performance.
  • To ensure optimal thermal performance, use a PCB with a thermal via array under the device, and consider using a heat sink or thermal interface material. Keep the PCB layout symmetrical and balanced to minimize electromagnetic interference (EMI).
  • Handle the device in an ESD-controlled environment, and use ESD-protective packaging and handling materials. Ensure that all equipment and tools are properly grounded, and consider using an ESD wrist strap or mat.
  • Use a soldering iron with a temperature of 250°C to 270°C, and ensure that the soldering time is less than 3 seconds. Use a solder with a melting point above 217°C, and avoid using excessive solder or flux.

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MRFE6VS25NR1 Overview

Use the download button to access the MRFE6VS25NR1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MRFE6, or try a keyword search, such as RF Power Field-Effect Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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