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MSASU168AB7105KTNA01 - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT CAP, MLCC, 0603, 50V, X7R, 1uF, 10%, T&R

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MSASU168AB7105KTNA01 - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 0603/1608
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MSASU168AB7105KTNA01 Details

  • Manufacturer Part Number:

    MSASU168AB7105KTNA01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    1 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    0.8 mm

  • JESD-609 Code:

    e3

  • Length:

    1.6 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, Paper, 7 Inch

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    50 V

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    0.8 mm

MSASU168AB7105KTNA01 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MSASU168AB7105KTNA01 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The MSASU168AB7105KTNA01 has a thermal resistance of 35°C/W. To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and avoid blocking the airflow around the component.
  • The maximum operating temperature range for the MSASU168AB7105KTNA01 is -40°C to 125°C.
  • Store the MSASU168AB7105KTNA01 in a dry, cool place, away from direct sunlight. Use a moisture barrier bag or a dry pack with a desiccant to maintain a relative humidity of 20% or less.
  • The recommended soldering profile for the MSASU168AB7105KTNA01 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.

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MSASU168AB7105KTNA01 Overview

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Part Image 0603X105K500SW-C Capax Technologies Inc

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Part Image CL10B105KB8NNNL Samsung Electro-Mechanics

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For a full list of alternate parts for MSASU168AB7105KTNA01, check out Findchips.com