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MWPR1516CFM - NXP

Description: Wireless Charging ICs WL Charger RCVR ASSP w/ ARM Cortex-M0+

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Symbol
MWPR1516CFM - NXP - PCB symbol
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PCB Footprints
MWPR1516CFM - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-pin QFN
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3D Models
MWPR1516CFM - NXP - 3D model - Quad Flat No-Lead - 32-pin QFN
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MWPR1516CFM Details

  • Manufacturer Part Number:

    MWPR1516CFM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    YES

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    13

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Speed:

    24 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.13 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MWPR1516CFM Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal interface material (TIM) for better heat transfer.
  • Use the device's power-down modes, adjust the clock frequency, and optimize the voltage regulator module (VRM) settings. Implement dynamic voltage and frequency scaling (DVFS) to reduce power consumption during idle periods.
  • Use 10uF and 100nF decoupling capacitors, placed as close as possible to the device's power pins. Ensure the capacitors are rated for the device's maximum operating frequency.
  • Use NXP's development boards and software tools, such as the MCUXpresso IDE, to debug and troubleshoot issues. Analyze the device's registers, use oscilloscopes and logic analyzers to monitor signals, and consult NXP's application notes and community forums.
  • Ensure the device is mounted on a heat sink or thermal interface material (TIM) to dissipate heat. Use thermal simulation tools to model the device's thermal performance and optimize the PCB design for heat dissipation.

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MWPR1516CFM Overview

Use the download button to access the MWPR1516CFM schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MWPR1, or try a keyword search, such as Microcontrollers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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