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NBB-310-T1 - Qorvo

Description: RF Amplifier DC-12GHz Gain 13dB P1dB 15.2dBm@6GHz

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NBB-310-T1 - Qorvo  - 3D model
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NBB-310-T1 Details

  • Manufacturer Part Number:

    NBB-310-T1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, CERAMIC, MICRO-X, 4 PIN

  • Country Of Origin:

    USA

  • ECCN Code:

    5A991.G

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    6.86

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    9 dB

  • Input Power-Max (CW):

    20 dBm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Operating Frequency-Max:

    12000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -45 °C

  • Package Body Material:

    CERAMIC

  • Package Equivalence Code:

    SL,4LEAD,.07SQ

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • VSWR-Max:

    2

NBB-310-T1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used to connect the device to the antenna.
  • The device requires a 3.3V power supply and a bias current of 10mA to 20mA. A voltage regulator and a bias resistor network can be used to set the bias voltage and current. The bias voltage should be set to 1.5V to 2.5V for optimal performance.
  • A pi-network or a T-network can be used for input and output matching. The network should be designed to match the device's input and output impedance of 50 ohms. The network should also be optimized for the specific frequency band of operation.
  • The device has a thermal pad that should be connected to a heat sink or a thermal ground plane. The PCB should be designed to dissipate heat efficiently. A thermal interface material can be used to improve heat transfer between the device and the heat sink.
  • The device is sensitive to ESD damage. ESD protection devices such as TVS diodes or ESD protection arrays should be used to protect the device from electrostatic discharge. The protection devices should be placed as close as possible to the device.

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NBB-310-T1 Overview

Use the download button to access the NBB-310-T1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like NBB-3, or try a keyword search, such as RF/Microwave Amplifiers

About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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Part Image NBB-310-T3 RF Micro Devices Inc

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