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NCP115AMX330TCG - onsemi

Description: Operating Input Voltage Range: 1.7 V to 5.5 V; Low Dropout: 250 mV Typical at 300 mA @ 2.8 V; High PSRR 70dB at 1kHz; Thermal Shutdown and Current Limit Protections; Very Low Quiescent Current of Typ. 50 µA; Available in XDFN4 1.0 x 1.0 mm Package; +/- 1% typical Vout Accuracy @25 °C; Available in Fixed Voltage Options: 0.8 V to 3.6 V; Available in TSOP5 Package

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NCP115AMX330TCG Details

  • Manufacturer Part Number:

    NCP115AMX330TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2018-08-06

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.26 V

  • Dropout Voltage1-Nom:

    0.215 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.00561%

  • Load Regulation-Max(%):

    0.03%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1 mm

NCP115AMX330TCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from onsemi provides additional recommendations.
  • To ensure reliable start-up, it's essential to follow the recommended start-up sequence, ensure the input voltage is within the specified range, and provide a sufficient input capacitance to stabilize the input voltage. Additionally, the output voltage should be monitored to ensure it reaches the desired level before enabling the load.
  • When selecting the output inductor and capacitor values, consider the desired output voltage ripple, inductor core saturation, and capacitor ESR. The datasheet provides some guidelines, but a more detailed analysis of the converter's operating conditions and load requirements is necessary to ensure optimal component selection.
  • To troubleshoot issues with the converter's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure the output capacitor is suitable for the application. If the issue persists, consult the datasheet and application notes for guidance on adjusting the feedback loop compensation or checking for component failures.
  • Operating the converter at high ambient temperatures can reduce its reliability and lifespan. Ensure the device is properly heat-sinked, and consider derating the output current or using a heat sink with a high thermal conductivity. Consult the datasheet and application notes for guidance on thermal management and derating.

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