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NCV8401ADTRKG - onsemi

Description: Short Circuit Protection; Thermal Shutdown with Automatic Restart; Integrated Clamp for Inductive Switching; ESD Protection; dV/dt Robustness; Analog Drive Capability (Logic Level Input); RoHs Compliant; AEC-Q101 Qualified; NCV Prefix for Automotive and Other Applications Requiring Site and Change Control; This is a PbFree Device

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NCV8401ADTRKG Details

  • Manufacturer Part Number:

    NCV8401ADTRKG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Package Description:

    DPAK, 3/2 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    CURRENT LIMIT:40A

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.54 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.38 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.29 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.095 mm

NCV8401ADTRKG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range.
  • To troubleshoot issues with the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly sized and that the device is not overheating.
  • To minimize EMI and EMC issues, use a good PCB layout, ensure proper grounding, and consider using shielding or filtering components. Additionally, follow proper decoupling and bypassing techniques.

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NCV8401ADTRKG Overview

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