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NRVBD360VT4G - onsemi

Description: These are Pb-Free Packages; AEC-Q101 Qualified and PPAP Capable; SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Extremely Fast Switching; Extremely Low Forward Drop; Platinum Barrier with Avalanche Guardrings Mechanical Characteristics:; Case: Epoxy, Molded; Weight: 0.4 gram (approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead and Mounting Surface Temperature for Soldering Purposes: 260 °

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NRVBD360VT4G Overview

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MBRD360TR Sangdest Microelectronics (Nanjing) Co Ltd