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NTSAF345T3G - onsemi

Description: Fine Lithography Trench−based Schottky Technology for Very Low; Forward Voltage and Low Leakage; Fast Switching with Exceptional Temperature Stability; Low Power Loss and Lower Operating Temperature; Higher Efficiency for Achieving Regulatory Compliance; High Surge Capability; These are Pb−Free and Halide−Free Devices; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These are Pb−Free and Halide−Free Devices

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NTSAF345T3G - onsemi

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