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PIC18F46K42-E/P - Microchip

Description: 8-bit Microcontrollers - MCU 64KB Flash, 4KB RAM, 1KB EEPROM, 12-bit ADC2, Vector Interrupts, DMA, MAP, DIA, DAC, Comp, PWM, CWG, HLT, WWDT, SCAN/CRC, ZCD, PPS, UART, SPI/I2C, IDLE/DOZE/PMD

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PCB Footprints
PIC18F46K42-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 40-Lead Plastic Dual In-Line (P) - 600 mil Body [PDIP]
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PIC18F46K42-E/P Details

  • Manufacturer Part Number:

    PIC18F46K42-E/P

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    PDIP-40

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2017-06-16

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    7

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES WITH 2.5VMIN @32 MHZ AND 2.3VMIN @16MHZ

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    PIC18

  • Clock Frequency-Max:

    64 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e3

  • Length:

    52.234 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    2

  • Number of External Interrupts:

    3

  • Number of I/O Lines:

    36

  • Number of Terminals:

    40

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    4096

  • RAM (words):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    4.826 mm

  • Speed:

    64 MHz

  • Supply Current-Max:

    120 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

PIC18F46K42-E/P Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 16 MHz. However, it's recommended to use a clock frequency of 8 MHz or less to ensure reliable operation.
  • The BOR voltage can be configured using the BORV and BORW bits in the Configuration Words (CONFIG1H and CONFIG2L). The BOR voltage can be set to 1.9V, 2.7V, or 4.2V.
  • No, the ADC and comparator modules share the same analog input pins, so they cannot be used simultaneously. You need to select which module to use based on your application requirements.
  • The internal pull-up resistors can be enabled by setting the WPUB bit in the TRIS register for the corresponding I/O pin. Note that the pull-up resistors are only available on certain I/O pins, as specified in the datasheet.
  • The maximum current that can be sourced or sunk by an I/O pin is 25 mA. However, it's recommended to limit the current to 10 mA or less to ensure reliable operation and prevent overheating.

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PIC18F46K42-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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